Product Detail

Samsung eMMC

Collection
|
Technology : eMMC
Send Mail  Inquiry
product warranty
Guarantee
Warranty
Delivery
Product details
Products Reviews(0)



Samsung   EMMC







料号
版本
容量
工作电压
接口
封装尺寸
工作温度
生产状态
KLMCG2UCTB-B041
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
MassProduction
KLMDG4UCTB-B041
eMMC5.1
128GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
MassProduction
KLM4G1FETE-B041
eMMC5.1
4GB
1.8,3.3V/3.3V
HS400
11x10x0.8mm
-25~85°C
MassProduction
KLM8G1GEUF-B04P
eMMC5.1
8GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~85°C
MassProduction
KLM8G1GEUF-B04Q
eMMC5.1
8GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~105°C
MassProduction
KLMAG2GEUF-B04P
eMMC5.1
16GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~85°C
MassProduction
KLMAG2GEUF-B04Q
eMMC5.1
16GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~105°C
MassProduction
KLMBG4GEUF-B04P
eMMC5.1
32GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~85°C
MassProduction
KLMBG4GEUF-B04Q
eMMC5.1
32GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~105°C
MassProduction
KLMCG2KCTA-B041
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
MassProduction
KLMCG2UCTA-B041
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
MassProduction
KLMDG4UCTA-B041
eMMC5.1
128GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
MassProduction
KLMEG8UCTA-B041
eMMC5.1
256GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
MassProduction
KLM8G1GEME-B041
eMMC5.1
8GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
EOL
KLM8G1GEND-B031
eMMC5.0
8GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
EOL
KLM8G1GESD-B03P
eMMC5.0
8GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~85°C
MassProduction
KLM8G1GESD-B03Q
eMMC5.0
8GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~105°C
MassProduction
KLM8G1GESD-B04P
eMMC5.1
8GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~85°C
MassProduction
KLM8G1GESD-B04Q
eMMC5.1
8GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~105°C
MassProduction
KLM8G1GETF-B041
eMMC5.1
8GB
1.8,3.3V/3.3V
HS400
11.5x13x0.8mm
-25~85°C
MassProduction
KLM8G1WEPD-B031
eMMC5.0
8GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
EOL
KLMAG1JENB-B041
eMMC5.1
16GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
EOL
KLMAG1JETD-B041
eMMC5.1
16GB
1.8,3.3V/3.3V
HS400
11.5x13x0.8mm
-25~85°C
MassProduction
KLMAG2GEND-B031
eMMC5.0
16GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
EOL
KLMAG2GEND-B041
eMMC5.1
16GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
EOL
KLMAG2GESD-B03P
eMMC5.0
16GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~85°C
MassProduction
KLMAG2GESD-B03Q
eMMC5.0
16GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~105°C
MassProduction
KLMAG2GESD-B04P
eMMC5.1
16GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~85°C
MassProduction
KLMAG2GESD-B04Q
eMMC5.1
16GB
1.8/3.3V
HS400
11.5x13x0.8mm
-40~105°C
MassProduction
KLMAG2WEPD-B031
eMMC5.0
16GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
EOL
KLMBG2JENB-B041
eMMC5.1
32GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMBG2JETD-B041
eMMC5.1
32GB
1.8,3.3V/3.3V
HS400
11.5x13x0.8mm
-25~85°C
MassProduction
KLMBG4GEND-B031
eMMC5.0
32GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMBG4GEND-B041
eMMC5.1
32GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMBG4GESD-B03P
eMMC5.0
32GB
1.8/3.3V
HS400
11.5x13x1.0mm
-40~85°C
MassProduction
KLMBG4GESD-B03Q
eMMC5.0
32GB
1.8/3.3V
HS400
11.5x13x1.0mm
-40~105°C
MassProduction
KLMBG4GESD-B04P
eMMC5.1
32GB
1.8/3.3V
HS400
11.5x13x1.0mm
-40~85°C
MassProduction
KLMBG4GESD-B04Q
eMMC5.1
32GB
1.8/3.3V
HS400
11.5x13x1.0mm
-40~85°C
MassProduction
KLMBG4WEBD-B031
eMMC5.0
32GB
1.8/3.3V
HS400
11.5x13x0.8mm
-25~85°C
EOL
KLMBG4WERD-B041
eMMC5.1
32GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMCG2KETM-B041
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMCG4JENB-B041
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMCG4JETD-B041
eMMC5.1
64GB
1.8,3.3V/3.3V
HS400
11.5x13x1.0mm
-25~85°C
MassProduction
KLMCG4JEUD-B04P
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x1.2mm
-40~85°C
Massproduction
KLMCG4JEUD-B04Q
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x1.2mm
-40~105°C
Massproduction
KLMCG4VERF-B041
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMCG8GEND-B031
eMMC5.0
64GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMCG8GEND-B041
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMCG8GESD-B03P
eMMC5.0
64GB
1.8/3.3V
HS400
11.5x13x1.0mm
-40~85°C
MassProduction
KLMCG8GESD-B03Q
eMMC5.0
64GB
1.8/3.3V
HS400
11.5x13x1.0mm
-40~105°C
MassProduction
KLMCG8GESD-B04P
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x1.0mm
-40~85°C
MassProduction
KLMCG8GESD-B04Q
eMMC5.1
64GB
1.8/3.3V
HS400
11.5x13x1.0mm
-40~105°C
MassProduction
KLMCG8WEBD-B031
eMMC5.0
64GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMDG4UERM-B041
eMMC5.1
128GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMDG8JENB-B041
eMMC5.1
128GB
1.8/3.3V
HS400
11.5x13x1.2mm
-25~85°C
EOL
KLMDG8JEUD-B04P
eMMC5.1
128GB
1.8/3.3V
HS400
11.5x13x1.2mm
-40~85°C
Massproduction
KLMDG8JEUD-B04Q
eMMC5.1
128GB
1.8/3.3V
HS400
11.5x13x1.2mm
-40~105°C
Massproduction
KLMDG8VERF-B041
eMMC5.1
128GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL
KLMDGAWEBD-B031
eMMC5.0
128GB
1.8/3.3V
HS400
11.5x13x1.4mm
-25~85°C
EOL
KLMEG8UERM-C041
eMMC5.1
256GB
1.8/3.3V
HS400
11.5x13x1.0mm
-25~85°C
EOL





Home                                    Product                                        News                                   About                                        Contact
Tel: +86-0755-84866816  
Tel: +86-0755-84828852
Mail:  kevin@glochip.com
Web:  www.chip.com.hk
Rm401.1st Building, Dayun software Longgang Avenue, Longgang district,Shenzhen
全球芯微信公众号
Samsung Micron SKhynix Kingston Sandisk  Kioxia Nanya Winbond MXIC ESMT Longsys Biwin HosgingGlobal  BoyaMicro  Piecemakers Rayson  Skyhigh  Netsol

SRAM MRAM SDRAM DDR1 DDR2 DDR3 DDR4 DDR5 LPDDR3 LPDDR4 LPDDR4X LPDDR5 LPDDR5X NAND NOR eMMC UFS eMCP uMCP SSD Module