Product Detail

Netsol Parallel (PPI) MRAM

Collection
|
product warranty
Guarantee
Warranty
Delivery
Product details
Products Reviews(0)

Parallel STT-MRAM Products

NETSOL Parallel MRAM Products are ideal for applications that must store and retrieve data and programs quickly and frequently due to the non-volatility, virtually unlimited endurance and fast-write characteristics of STT-MRAM.

They are suited for code storage, data logging, backup memory and working memory in industrial designs and can replace Low power SRAM, FeRAM or nvSRAM with same functionality and non-volatility.

Key Features

  • 1Mb, 2Mb, 4Mb, 8Mb, 16Mb, 32Mb, 64Mb Density

  • Power Supply : 1.8V (1.71V ~ 1.98V)or 3.3V (2.7V ~ 3.6V)

  • Parallel asynchronous interface x16/x8 I/O

  • page read/write function for high performance

  • Data Retention : 10 years

  • Read Endurance : unlimited

  • Write Endurance : 1014

  • No external ECC required

  • Package Type : 48FBGA, 44TSOP2, 54TSOP2

Product List

Density
Part Number
Organization
VDD(V)
Access Time(ns)
Temperature
Package
Status
Data Sheet
1M bit
S3R1016V1M
64Kx16
2.70~3.60
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
S3R1008V1M
128Kx8
2.70~3.60
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
1M bit
S3R1016R1M
64Kx16
1.71~1.98
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
S3R1008R1M
128Kx8
1.71~1.98
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
2M bit
S3R2016V1M
128Kx16
2.70~3.60
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
S3R2008V1M
256Kx8
2.70~3.60
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
2M bit
S3R2016R1M
128Kx16
1.71~1.98
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
S3R2008R1M
256Kx8
1.71~1.98
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
4M bit
S3R4016V1M
256Kx16
2.70~3.60
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
S3R4008V1M
512Kx8
2.70~3.60
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
4M bit
S3R4016R1M
256Kx16
1.71~1.98
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
S3R4008R1M
512Kx8
1.71~1.98
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
8M bit
S3R8016V1M
512Kx16
2.70~3.60
70ns
-40℃ to 85℃
48FBGA, 54TSOP2
Mass Prod.
S3R8008V1M
1Mx8
2.70~3.60
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
8M bit
S3R8016R1M
512Kx16
1.71~1.98
70ns
-40℃ to 85℃
48FBGA, 54TSOP2
Mass Prod.
S3R8008R1M
1Mx8
1.71~1.98
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
16M bit
S3R1616V1M
1Mx16
2.70~3.60
70ns
-40℃ to 85℃
48FBGA, 54TSOP2
Mass Prod.
S3R1608V1M
2Mx8
2.70~3.60
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
16M bit
S3R1616R1M
1Mx16
1.71~1.98
70ns
-40℃ to 85℃
48FBGA, 54TSOP2
Mass Prod.
S3R1608R1M
2Mx8
1.71~1.98
70ns
-40℃ to 85℃
44TSOP2, 48FBGA
Mass Prod.
32M bit
S3R3216V1M
2Mx16
2.70~3.60
70ns
-40℃ to 85℃
48FBGA, 54TSOP2
Mass Prod.
S3R3216R1M
2Mx16
1.71~1.98
70ns
-40℃ to 85℃
48FBGA, 54TSOP2
Mass Prod.
64M bit
S3R6416V1M
4Mx16
2.70~3.60
70ns
-40℃ to 85℃
48FBGA
ES
S3R6416R1M
4Mx16
1.71~1.98
70ns
-40℃ to 85℃
48FBGA
ES

* ES : Engineer Sample, UD : Under Development


Home                                    Product                                        News                                   About                                        Contact
Tel: +86-0755-84866816  
Tel: +86-0755-84828852
Mail:  kevin@glochip.com
Web:  www.chip.com.hk
Rm401.1st Building, Dayun software Longgang Avenue, Longgang district,Shenzhen
全球芯微信公众号
Samsung Micron SKhynix Kingston Sandisk  Kioxia Nanya Winbond MXIC ESMT Longsys Biwin HosgingGlobal  BoyaMicro  Piecemakers Rayson  Skyhigh  Netsol

SRAM MRAM SDRAM DDR1 DDR2 DDR3 DDR4 DDR5 LPDDR3 LPDDR4 LPDDR4X LPDDR5 LPDDR5X NAND NOR eMMC UFS eMCP uMCP SSD Module