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华芯微特
屏驱控制MCU
电机控制MCU
通用控制MCU
华大电子
华大安全芯片
华大电子MCU
恒烁半导体
恒烁NOR FLASH
恒烁 MCU
晶存科技
Rayson LPDDR
Rayson DDR
Rayson eMMC
康盈半导体
Kowin eMMC
Kowin LPDDR
艾迪科泰
IDKT加密芯片
纽文微
ALPU加密芯片
瑞纳捷
Runjet MCU
Runjet加密芯片
博雅科技
博雅NOR FLASH
原相科技
Pixart CMOS Sensor
补丁科技
Piecemakers DDR
SkyHigh
Skyhigh NAND
Skyhigh eMCP
Skyhigh eMMC
Netsol
Netsol SRAM
Netsol MRAM
三星半导体
Samsung DDR
Samsung LPDDR
Samsung eMMC
Samsung UFS
Samsung uMCP
镁光科技
Micron DDR
Micron LPDDR
Micron eMMC
Micron UFS
Micron NAND
海力士
SK hynxi DDR
SK hynix LPDDR
SK hynix eMMC
SK hynix UFS
SK hynix uMCP
南亚科技
Nanya DDR
Nanya LPDDR
铠侠半导体
Kioxia NAND
Kioxia eMMC
Kioxia UFS

产品详情

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三星LPDDR

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产品详情

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Samsung LPDDR5X
料号	容量	架构	速率	工作电压	工作温度	封装
K3KL3L30CM-BGCT	64Gb	x64	7500Mbps	1.8/1.05/0.9/0.5V	-25~85°C	496FBGA
K3KL3L30CM-JGCT	64Gb	x64	7500Mbps	1.8/1.05/0.9/0.5V	-25~85°C	441FBGA
K3KL3L30CM-MGCT	64Gb	x32	7500Mbps	1.8/1.05/0.9/0.5V	-25~85°C	315FBGA
K3KL4L40DM-BGCT	96Gb	x64	7500Mbps	1.8/1.05/0.9/0.5V	-25~85°C	496FBGA
K3KL5L50CM-BGCT	128Gb	x64	7500Mbps	1.8/1.05/0.9/0.5V	-25~85°C	496FBGA
K3KL5L50CM-MGCT	128Gb	x32	7500Mbps	1.8/1.05/0.9/0.5V	-25~85°C	315FBGA
K3KL8L80CM-MGCT	32Gb	x32	7500Mbps	1.8/1.05/0.9/0.5V	-25~85°C	315FBGA
SamsungLPDDR5
料号	容量	架构	速率	工作电压	工作温度	封装	生产状态
K3LK2K20BM-BGCN	48Gb	x64	5500Mbps	1.8/1.05/0.9/0.5V	-25~85°C	496FBGA	Sample
Samsung LPDDR4x
料号	架构	速率	工作电压	工作温度	封装	生产状态
K3UH5H50AM-JGCR	x64	4266Mbps	1.8/1.1/0.6V	-25~85°C	432FBGA	Sample
K3UH7H70AM-JGCR	x64	4266Mbps	1.8/1.1/0.6V	-25~85°C	432FBGA	Sample
K4U6E3S4AA-MGCR	x32	4266Mbps	1.8/1.1/0.6V	-25~85°C	200FBGA	Sample
K4UBE3D4AA-MGCR	x32	4266Mbps	1.8/1.1/0.6V	-25~85°C	200FBGA	Sample
K4UCE3Q4AA-MGCR	x32	4266Mbps	1.8/1.1/0.6V	-25~85°C	200FBGA	Sample
K3UH5H50AM-JGCL	x64	4266Mbps	1.8/1.1/0.6V	-25~85°C	432FBGA	MassProduction
K3UH7H70AM-JGCL	x64	4266Mbps	1.8/1.1/0.6V	-25~85°C	432FBGA	MassProduction
K3UHAHA0AM-AGCL	x64	4266Mbps	1.8/1.1/0.6V	-25~85°C	556FBGA	MassProduction
K4U6E3S4AA-MGCL	x32	4266Mbps	1.8/1.1/0.6V	-25~85°C	200FBGA	MassProduction
K4UBE3D4AA-MGCL	x32	4266Mbps	1.8/1.1/0.6V	-25~85°C	200FBGA	MassProduction
K4UCE3Q4AA-MGCL	x32	4266Mbps	1.8/1.1/0.6V	-25~85°C	200FBGA	MassProduction
K4U8E3S4AD-GFCL	x32	4266Mbps	1.8/1.1/0.6V	-40~95°C	200FBGA	MassProduction
K4U8E3S4AD-GHCL	x32	4266Mbps	1.8/1.1/0.6V	-40~105°C	200FBGA	MassProduction
K4U8E3S4AD-GUCL	x32	4266Mbps	1.8/1.1/0.6V	-40~125°C	200FBGA	MassProduction
K3UH5H50AM-AGCL	x64	4266Mbps	1.8/1.1/0.6V	-25~85°C	556FBGA	批量生产
K3UH6H60BM-AGCL	x64	4266Mbps	1.8/1.1/0.6V	-25~85°C	556FBGA	MassProduction
K3UH7H70AM-AGCL	x64	4266Mbps	1.8/1.1/0.6V	-25~85°C	556FBGA	MassProduction
K4U2E3S4AA-GFCL	x32	4266Mbps	1.8/1.1/0.6V	-40~95°C	200FBGA	MassProduction
K4U2E3S4AA-GHCL	x32	4266Mbps	1.8/1.1/0.6V	-40~105°C	200FBGA	MassProduction
K4U2E3S4AA-GUCL	x32	4266Mbps	1.8/1.1/0.6V	-40~125°C	200FBGA	MassProduction
K4U6E3S4AM-GFCL	x32	4266Mbps	1.8/1.1/0.6V	-40~95°C	200FBGA	MassProduction
K4U6E3S4AM-GHCL	x32	4266Mbps	1.8/1.1/0.6V	-40~105°C	200FBGA	MassProduction
K4U6E3S4AM-GUCL	x32	4266Mbps	1.8/1.1/0.6V	-40~125°C	200FBGA	MassProduction
K4UBE3D4AM-GFCL	x32	4266Mbps	1.8/1.1/0.6V	-40~95°C	200FBGA	MassProduction
K4UBE3D4AM-GHCL	x32	4266Mbps	1.8/1.1/0.6V	-40~105°C	200FBGA	Sample
K4UBE3D4AM-GUCL	x32	4266Mbps	1.8/1.1/0.6V	-40~125°C	200FBGA	MassProduction
K4UHE3D4AA-GFCL	x32	4266Mbps	1.8/1.1/0.6V	-40~95°C	200FBGA	MassProduction
K4UHE3D4AA-GHCL	x32	4266Mbps	1.8/1.1/0.6V	-40~105°C	200FBGA	Sample
K4UHE3D4AA-GUCL	x32	4266Mbps	1.8/1.1/0.6V	-40~125°C	200FBGA	MassProduction
Samsung LPDDR4
料号	架构	速率	工作电压	工作温度	封装	生产状态
K4F2E3S4HA-TFCL	x32	4266Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4F2E3S4HA-THCL	x32	4266Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4F2E3S4HA-TUCL	x32	4266Mbps	1.8/1.1/1.1V	-40~125°C	200FBGA	MassProduction
K4F6E3S4HM-TFCL	x32	4266Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4F6E3S4HM-THCL	x32	4266Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4F6E3S4HM-TUCL	x32	4266Mbps	1.8/1.1/1.1V	-40~125°C	200FBGA	MassProduction
K4FBE3D4HM-TFCL	x32	4266Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4FBE3D4HM-THCL	x32	4266Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4FBE3D4HM-TUCL	x32	4266Mbps	1.8/1.1/1.1V	-40~125°C	200FBGA	MassProduction
K4FHE3D4HA-TFCL	x32	4266Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4FHE3D4HA-THCL	x32	4266Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4FHE3D4HA-TUCL	x32	4266Mbps	1.8/1.1/1.1V	-40~125°C	200FBGA	MassProduction
K4F6E304HB-MGCJ	x32	3733Mbps	1.8/1.1/1.1V	-25~85°C	200FBGA	MassProduction
K4F6E3S4HM-MGCJ	x32	3733Mbps	1.8/1.1/1.1V	-25~85°C	200FBGA	MassProduction
K4F8E3S4HD-MGCL	x32	4266Mbps	1.8/1.1/1.1V	-25~85°C	200FBGA	MassProduction
K4F8E3S4HD-GFCL	x32	4266Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4F8E3S4HD-GHCL	x32	4266Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4F8E3S4HD-GUCL	x32	4266Mbps	1.8/1.1/1.1V	-40~125°C	200FBGA	MassProduction
K4F2E3S4HA-GFCL	x32	4266Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4F2E3S4HA-GHCL	x32	4266Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4F2E3S4HA-GUCL	x32	4266Mbps	1.8/1.1/1.1V	-40~125°C	200FBGA	MassProduction
K4F2E3S4HM-MFCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4F2E3S4HM-MHCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4F4E3S4HF-GFCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4F4E3S4HF-GHCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4F4E3S4HF-GUCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~125°C	200FBGA	MassProduction
K4F6E3D4HB-MFCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4F6E3D4HB-MHCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4F6E3S4HM-GFCL	x32	4266Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4F6E3S4HM-GHCL	x32	4266Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4F6E3S4HM-GUCL	x32	4266Mbps	1.8/1.1/1.1V	-40~125°C	200FBGA	MassProduction
K4F8E3S4HB-MFCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4F8E3S4HB-MHCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4FBE3D4HM-GFCL	x32	4266Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4FBE3D4HM-GHCL	x32	4266Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4FBE3D4HM-GUCL	x32	4266Mbps	1.8/1.1/1.1V	-40~125°C	200FBGA	MassProduction
K4FHE3D4HA-GFCL	x32	4266Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4FHE3D4HA-GHCL	x32	4266Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
K4FHE3D4HA-GUCL	x32	4266Mbps	1.8/1.1/1.1V	-40~125°C	200FBGA	MassProduction
K4FHE3D4HM-MFCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~95°C	200FBGA	MassProduction
K4FHE3D4HM-MHCJ	x32	3733Mbps	1.8/1.1/1.1V	-40~105°C	200FBGA	MassProduction
Samsung LPDDR3
料号	容量	架构	速率	工作电压	工作温度	封装	生产状态
K4E6E304EC-EGCG	16Gb	x32	2133Mbps	1.8/1.2/1.2V	-25~85°C	178FBGA	MassProduction
K4E8E324EB-EGCG	8Gb	x32	2133Mbps	1.8/1.2/1.2V	-25~85°C	178FBGA	MassProduction
K4EBE304EC-EGCG	32Gb	x32	2133Mbps	1.8/1.2/1.2V	-25~85°C	178FBGA	MassProduction
K4E6E304ED-EGCG	16Gb	x32	2133Mbps	1.8/1.2/1.2V	-25~85°C	178FBGA	MassProduction
K4E8E324ED-EGCG	8Gb	x32	2133Mbps	1.8/1.2/1.2V	-25~85°C	178FBGA	MassProduction
K4EBE304ED-EGCG	32Gb	x32	2133Mbps	1.8/1.2/1.2V	-25~85°C	178FBGA	MassProduction

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